VFD Array Grid
Encapsulation Cover Board
IC Lead Frame
Technology Decoration
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  Product Material:

Materials maximum effective size

600mmX1300mm

Material thickness

0.05mm~1.2mm

Processing materials
(Ferric chloride can be
etched metal)
(for special metal
etching can be
negotiated)

Stainless steel series

For example: SUS301 SUS302 SUS303  SUS304 SUS316 SUS430 Etc.

Copper and copper
alloy series

Copper、Brass、Bronze、 Copper-nickel alloy、C194 Copper (Lead frame materials used)

Aluminum and
aluminum alloy series

For example:1A991A9510501A50 Etc.

Nickel and nickel alloy series

Pure Nickel、E-nickel alloy、
Nickel-manganese alloy
For example:YEF4264J424J429 Etc.

  Product precision:

Material thickness/Item

0.05mm~0.10mm

0.10mm~0.20mm

0.20mm~1.2mm

Minimum aperture

1.3X Material
thickness

1.2X Material
thickness

1.1X Material
thickness

The smallest
diameter

Less than Material thickness

to be equal to
Material thickness

1.1X Material
thickness

General Tolerance

±0.015~0.035mm

±0.035~0.05mm

±0.05~0.10mm

Graphic location of Tolerance

The tolerance of the graphics’width between centres is ±0.015mm


Note:The above figures are for reference only, the specific products to specific analysis. Product dimensional tolerances and material thickness, product size, product graphics have some relations, especially relations between the maximum thickness and materials.

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